Language:
Underfill is one component epoxy designed to improve attachment strength of BGA, CSP, and Flip-chip.
It is to protect solder joints during mechanical stress such as drop and bending.
| Product | Appearance | Viscosity (cps@25℃) |
Cure Condition | Tg(℃) | CTE (α1/α2) (ppm) |
Hardness | Pot-life(@25℃) | Storage(≤40%RH) |
|---|---|---|---|---|---|---|---|---|
| HI - FILL 300 | Milky-white | 2,200~3,400 | 5min@135℃ | 14 | 64/198 | 70~80A | 7days | 1~10℃ |
| 3075BHF | Black | 1,500~2,500 | 7min@150℃ | 28 | 47/217 | 80~90A | 7days | 1~10℃ |
| 3075YHF | Yellow | 1,500~2,500 | 7min@150℃ | 28 | 47/217 | 80~90A | 7days | 1~10℃ |
| 3077YHF | Milky-white | 1,000~2,000 | 5min@135℃ | 14 | 64/198 | 70~80A | 7days | 1~10℃ |
| 3075FS | Black | 500~1,500 | 10min@80℃ 5min@100℃ |
18 | 74/191 | 75~85A | 1days | -20℃ |
| 3000BCK2 | Black | 300~800 | 8min@130℃ | 86 | 65/204 | 75~85D | 3dyas | -20℃ |
| Product | Appearance | Viscosity (cps@25℃) |
Cure Condition | Tg(℃) | CTE (α1/α2) (ppm) |
Hardness | Pot-life(@25℃) | Storage(≤40%RH) |
|---|---|---|---|---|---|---|---|---|
| 3210 | Black | 50,000~70,000 | 60min@150℃ | 83 | 29/133 | 80~90D | 1day | -20℃ |
| 3230-4 | Black | 55,000~75,000 | 120min@165℃ | 127 | 28/114 | 80~90D | 1day | -20℃ |