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Sparkle Balls are very small spheres of high-purity solder for micro soldering system.
The most important advantages of solder balls are their very clean surfaces and exact solder quantity control.
Solder balls are packed in argon gas for delivery to the user.
A wide range of solder types including low and high temperature alloys can be produced as Sparkle Ball.
| Type | Form | Diameter (φmm) | Features |
|---|---|---|---|
| S Type |  |
0.1 ~ 1.0 | Diameter diviation is: φ0.1〜0.3mm미만：±5μm φ0.3〜0.5mm미만：±10μm φ0.5mm〜：±20μm ±10µm Type is available on request. |
※ Micro balls less than 0.1 dia, Cu or Ag cored ball are also available on request.
Conductor bumps on hybrid ICs, power transistors soldering miniature parts such as crystal resonators and diodes.
Most suitable for Ball Grid Array, Multi Chip Module, Chip On Board Flip Chip and CSP.
| Application method | Product | Physical property | Solid content | Viscosity (Pa-S) (25ºC) | Flux type Chlorine content | |
|---|---|---|---|---|---|---|
| Resin Type | Pin transcription | DELTALUX 529D-1n | Paste | 62.5% | 19 | RMA(0%) |
| Ball transcription | DELTALUX 533 | Paste | 67% | 9 | RA(0.2%) | |
| Dispenser | DELTALUX 527N | High viscous liquid | 70% | 13 | RMA(0%) | |
| Printing | DELTALUX 523H | Paste | 68% | 120 | RMA(0.05%) | |
| Water-soluble Type | Pin & Ball transfer | Sparkle Flux WF-6300LF | paste | 80% | 18 | - |
| Dispenser | Sparkle Flux WF-6090 | High viscous liquid | 79% | 110% | - | |