JIS Z 3282 / ISO9453: Chemical composition of lead-free solders
Class Symbol SMIC Item
1 2
SN 96.5
Ag 3
Cu 0.5
SN 96.5
Ag 3
Cu 0.5
A30C5 M705
Chemical Composition Mass%
Sn Pb Sb Bi Cu Au In Ag Al As Cd Fe Ni Zn
Remain 0.05
max
0.10
max
0.10
max
0.3
to
0.7
0.05
max
0.10
max
2.8
to
3.2
0.001
max
0.03
max
0.002
max
0.02
max
0.01
max
0.001
max
ECO SOLDER Products Guide
ECO SOLDER Alloy composition (wt%) Temp. (℃) Form
soldus line Peak Liquidus line BAR CORE BALL PASTE PRE FORM
M-series: Solidus line temp. 200 to 250 °C
M705 Sn-3.0Ag-0.5Cu 217 219 220
M30 Sn-3.5Ag 221 223 223
M31 Sn-3.5Ag-0.75Cu 217 219 219
M714 Sn-3.8Ag-0.7Cu 217 219 220
M715 Sn-3.9Ag-0.6Cu 217 219 226
M710 Sn-4.0Ag-0.5Cu 217 219 229
M34 Sn-1.0Ag-0.5Cu 217 219 227
M771 Sn-1.0Ag-0.7Cu 217 219 224
M35 Sn-0.3Ag-0.7Cu 217 219 227
M20 Sn-0.75Cu 227 229 229
M24MT Sn-0.7Cu-Ni-P-Ge 228 230 230
M24AP Sn-0.6Cu-Ni-P-Ge 227 228 228
M40 Sn-1.0Ag-0.7Cu-Bi-In 211 222 222
M47 Sn-0.3Ag-0.7Cu-0.5Bi-Ni 216 228 228
M773 Sn-0.5Bi-0.7Cu-Ni 225 229 229
M805 Sn-0.3Bi-0.7Cu 225 229 229
M53 Sn-3.0Ag-3.0Bi-3.0In 198 214 214
M794 Sn-3.4Ag-0.7Cu-3.2Bi-3.0Sb-Ni-x 210 221 221
M731 Sn-3.9Ag-0.6Cu-3.0Sb 221 224 226
M716 Sn-3.5Ag-0.5Bi-8.0In 196 208 214
M10 Sn-5.0Sb 240 243 243
M14 Sn-10Sb 245 248 266
M709 Sn-0.5Ag-6.0Cu 217 226 378
M760HT Sn-5.0Cu-0.15Ni 228 229 365
M711 Sn-0.5Ag-4.0Cu 217 226 344
M60 Sn-2.3Ag-Ni-x 221 222 225
M770 Sn-2.0Ag-Cu-Ni 218 220 224
M758 Sn-3.0Ag-3Bi-0.8Cu-Ni 205 215 215
M84 Sn-3.0Ag-0.5Cu-Ni 219 223 324
M85 Sn-0.3Ag-2.0Cu-Ni 218 231 332
M86 Sn-0.3Ag-0.7Cu-Ni 220 232 330
L-series: Solidus line temp. under 200 °C
L20 Sn-58Bi 139 141 141
L27 Sn-40Bi-Cu-Ni 130 139 174

- Peak temp. : Max. endothermic reaction point on DSC curve.

- Some alloy compositions may not be available in certain forms with special product size and grade.

- For inquiries regarding alloy compositions not listed above, please contact our sales representative or through our web site.